Free Book Online
Book Testing of Interposer-Based 2.5D Integrated Circuits


Testing of Interposer-Based 2.5D Integrated Circuits

2.2 (1829)

Log in to rate this item

    Available in PDF - DJVU Format | Testing of Interposer-Based 2.5D Integrated Circuits.pdf | Language: ENGLISH
    Ran Wang(Author) Krishnendu Chakrabarty(Author)

    Book details

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

3.4 (11675)
  • Pdf

*An electronic version of a printed book that can be read on a computer or handheld device designed specifically for this purpose.

Formats for this Ebook

Required Software Any PDF Reader, Apple Preview
Supported Devices Windows PC/PocketPC, Mac OS, Linux OS, Apple iPhone/iPod Touch.
# of Devices Unlimited
Flowing Text / Pages Pages
Printable? Yes

Book details

Read online or download a free book: Testing of Interposer-Based 2.5D Integrated Circuits


Review Text

The message text*: